The last Windows version of InitField.exe was incorrect. The bug is fixed. ASCII format for STL files is added.
The package ECHO3D is updated to include Mac OS version.
The package ECHO3D is updated to version 1.3. New features: field monitors. Several bugs in postprocessing are fixed.
Release of Version 3.3 of ECHO2D: Field monitors in ECHO2D are modified; Some bugs in matlab scripts for postprocessing of the filed monitors are fixed; Mac OS and Linux versions of ECHO2D are included.
The package ECHO3D is updated. The mesher is parallelized with threads. A GUI bug is fixed. A new example is added.
Version 3.2: a bug of mesh creation in ECHOz1 and ECHOz2 is fixed; small changes in GUIs; the manual is updated. The example with inconsistent results was found by Jean-Yves Raguin (PSI). It was a bug in the mesh creation. Following my debugging expierence with this example I have placed the following text in the manual. “The codes use a conformal finite-difference method. In the time-domain wake field calculations the mesh resolution with 5 mesh points on the rms bunch…
As default mesh use 5 mesh lines on sigma in vacuum and “NStepsInConductive=10” in metal. It means that the skin depth in the metal will be meshed with 10 mesh lines. If you increase the mesh density in vacuum by factor 2 (10 mesh lines on sigma) you should simultaneously increase by the same factor “NStepsInConductive” in metal: “NStepsInConductive=20”. It means that the calculation depth in the metal remains the same. For 20 mesh lines on sigma use ”NStepsInConductive=40” and so on. …
The package ECHO1D is updated to version 1.2. The algorithm is changed to avoid overflow errors for high conductive materials. The width of high conductive layer should be comparable with skin depth.
GUI version of ECHO2D is updated. Minor changes.
The package ECHO3D is updated to version 1.2. It is possible to use many materials now. A version with GUI interface for Windows is compiled. New manual with section about ECHO3D uploaded. The conductivity will be implemented in the next release.